P D Derate Above 25 o C. Data Sheet. March File Number
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P D Derate Above 25 o C. Data Sheet. March File Number Electrical Models. Ordering Information. Drain to Source Voltage Note 1. V DSS. V DGR. Gate to Source Voltage. Drain Current. Pulsed Drain Current. Pulsed Avalanche Rating. Figure 4. Figures 6, 14, Power Dissipation. Derate Above 25 o C. Operating and Storage Temperature. Maximum Temperature for Soldering. Leads at 0. T pkg. This is a stress only rating and operation of the.
No Preview Available! Drain to Source Breakdown Voltage. Zero Gate Voltage Drain Current. Gate to Source Leakage Current. BV DSS.
I DSS. I GSS. Gate to Source Threshold Voltage. Drain to Source On Resistance. V GS TH. Thermal Resistance Junction to Case. Thermal Resistance Junction to. Turn-On Time. Turn-On Delay Time. Rise Time. Turn-Off Delay Time. Fall Time. Turn-Off Time. Figures 18, Total Gate Charge. Gate Charge at 10V. Threshold Gate Charge.
Gate to Source Gate Charge. Gate to Drain "Miller" Charge. Q g TOT. Figures 13, 16, Input Capacitance. Output Capacitance. Reverse Transfer Capacitance. C ISS. C OSS. C RSS. Figure Source to Drain Diode Voltage. Reverse Recovery Time. Reverse Recovered Charge. Intersil Electronic Components Datasheet. Part Number. View PDF for Mobile. Inchange Semiconductor. Motorola Inc. Samsung semiconductor. International Rectifier. Fairchild Semiconductor. Harris Corporation.
IRF530N Datasheet PDF
Rectifier utilize advanced processing techniques to achieve. This benefit,. The TO package is universally preferred for all. The low thermal. Absolute Maximum Ratings. T STG. Power Dissipation.
IRF530N MOSFET. Datasheet pdf. Equivalent
This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO contribute to its wide acceptance throughout the industry. Rectifier utilize advanced processing techniques to achieve. This benefit,. The TO package is universally preferred for all. The low thermal.